MSI’s motherboard, case and cooling division also has a ton to show off at COMPUTEX 2024, featuring a range of new products and innovations focused on customization and high performance. Key highlights include new PC builds, advanced cooling solutions, and next-generation motherboards.
MEG Series
- MEG MAESTRO 700L PZ: Features a one-piece 270-degree tempered glass for a panoramic interior view, compatible with ATX Back-connect motherboards.
- MEG Ai1600T PCIE5: Supports RGB lighting, built with premium titanium materials, ensuring high efficiency and stable power delivery. Estimated launch: Q4 2024.
MPG Series
- MPG VELOX 300R AIRFLOW / WHITE: Designed for optimal airflow with diamond-shaped cutouts, supports up to 13 fans, and 360mm radiators. MSRP: $149, launching Q3-Q4 2024.
- MPG CORELIQUID P Series: Includes a 4.3″ IPS panel for adjustable screen angles, streamlined cable connections, and supports both Intel and AMD sockets. Estimated launch: Q4 2024.
- MPG A1200GS PCIE5: Meets ATX 3.1 standards, available in 1200W, 1000W, and 850W variants. Estimated launch: Q4 2024.
MAG Series
- MAG X870 TOMAHAWK WIFI: Supports AMD Ryzen 9000/8000/7000 series, enhanced power design, PCIe 5.0 slot, and Wi-Fi 7. Estimated launch: Q3-Q4 2024.
- MAG CORELIQUID A Series: Features an enlarged copper base, pre-installed radiator fan and bracket for easy assembly. Estimated launch: Q4 2024.
PRO Series
- PRO X870-P WIFI: Similar to MAG X870 with support for AMD Ryzen processors and DIY-friendly features. Estimated launch: Q3-Q4 2024.
DIY Friendly Innovations
- Intel Next-Gen Motherboard: Supports Intel’s upcoming processors, screwless M.2 Shield Frozr, and EZ M.2 Clip II. Estimated launch: Q4 2024.
- Back-connect PC Build: Paired with MAG PANO 100L PZ WHITE featuring 270-degree tempered glass, showcasing clean cable arrangement.
Z790 PROJECT ZERO PLUS (CAMM2)
- Supports CAMM2 memory modules, offering lower latency and higher transmission efficiency. Enhanced power design and PCIe 5.0 slot. Estimated launch: Q4 2024.
Z790MPOWER PLUS (Mini_CUDIMM)
- Supports Mini_CUDIMM memory modules for lower latency and space efficiency. Dedicated for extreme overclocking. Estimated launch: Q4 2024.
Modern Series Case
- Minimalist design with mixed-material assembly, supports up to 50KG weight with solid maple wood handles. Front fan bracket accommodates various fan sizes. Estimated launch: Q4 2024.
NV-SFF-ready PC Build
- Utilizes MPG Z790I EDGI WIFI, meeting NV-SFF standards.
M.2 XPANDER-AERO SLIDER GEN5
- EZ-slide design for easy M.2 installation, AERO Fan Design for optimal cooling, and auto-detect feature for unused slots. Estimated launch: Q4 2024.
