Its been weeks since the last batch of rumors that Intel and AMD will be working together on something but now that becomes a reality with Intel officially announcement their new Intel Core processor multi-chip module (MCM) that combines the new 14nm Coffee Lake-H CPU die together a Vega-based 14nm Radeon GPU die from AMD. The GPU die is complimented by an HBM2 memory stack with a 1024-bit bus. Unlike Fiji and Vega 10 implementations, the new Intel MCM will feature a Embedded Multi-Die Interconnect Bridge (EMIB) which is a high-density, substrate-level wiring, linking CPU, GPU and HBM2 memory directly with CPU/GPU communicating via PCI-Express gen3 through the substrate.
If you’re looking for an ultrabook or ultra portable with a very slim very you might want to wait till these come out but for those looking for desktop solutions, the current market for GPUs are still looking good. You can shop online for new grphics cards from many popular stores and take advantage of holiday deals and ongoing offers where you can vouchers and use the coupons on Graphic Card from Argos. With a reduced footprint of the CPU+GPU module, the new Intel MCM offers a new approach in designing ultra portable devices and ultrabooks compared to traditional separate CPU and GPU modules on a large PCB. This promises more capable graphics performance on portables as well as possibility of reducing thickness further, even up to 11mm.
Specifications for the CPU and GPU are still to be announced but it is expected that devices featuring the new Intel MCM will be around during Q1 2018.
Official video presentation is below: